Design/Manufacturing Parameters	Standard Technology	Advanced Technology	Future Technology
Minimum Internal Line Width	0.005″	0.003″	>0.002″
Minimum Internal Spacing	0.005″	0.002″	>0.002″
Minimum External Line	0.005″	0.003″	>0.002″
Minimum External Spacing	0.005″	0.002″	>0.002″
Minimum Internal Copper Foil	0.0007″	0.00035″	0.000175″
Maximum Internal Copper Foil	0.0042″	0.0056″(+)	0.0084″(+)
Minimum External Copper (TOTAL)	0.0014″	0.0007″	0.00035″
Maximum External Copper (TOTAL)	0.0084″	0.0112″	0.0168
Minimum Internal Pad Over Drilled Hole Size	0.012″	0.006″	0.004″
Minimum External Pad Over Drilled Hole Size	0.010″	0.006″	0.004″
Minimum Drilled Hole Size	0.010″	0.006″	>0.005″
Minimum Aspect Ratio	12:01	16:01	18:01
Minimum Finished Hole Tolerance	0.003”+/-	0.002”+/-	0.001”+/-
Minimum SMT Pitch	0.015”	0.010”	>0.0012”
Maximum Layer Count	22 Lyr	30+ Lyr	50+ Lyr
Minimum Dielectric Thickness	0.002”	0.0012”	>0.0012”
Maximum Overall Thickness	.250	.400”	.750”
Minimum Board Thickness (Multi-Layer)	.031”	.014”	.008”
Buried Resistor Tolerance		30%	15%
Buried Capacitance PF / in 2		500	600

Testing	Standard Technology	Advanced Technology	Future Technology
Electrical Test – Continuity (ohms)	10	5	2
Electrical Test – Isolation (M ohms)	10	100	100+
Electrical Test – Minimum Component Pitch	.015″	.010″	.007″
Impedance Testing (incl. Differential) Range (ohms)	25 – 150	25 – 150	25 – 150
Impedance Tolerance	10% +/-	5% +/-	1 -2 ohms
DC Resistance Testing	X	X	X

Laminates	Standard Technology	Advanced Technology	Future Technology
FR-4 Epoxy (hi-Tf)	X	X	X
Polyimide	X	X	X
PTFE (Teflon)	X	X	X
Rogers 4350	X	X	X
Rogers 4003	X	X	X
Rogers (others)	X	X	X
BT	X	X	X
Cynate Ester	X	X	X
PPO / Polyphenylene Oxide	X	X	X
G-Tec / FR-408 / Nelco 4103-13	X	X	X