Panel Sizes
- 6 x 9 Through 26 x 30
- Maximum Circuits Size 24 x 28
Construction
- Balanced
- Controlled Dielectric
- Controlled Impedance +/- 5% (2% Available)
- Blind & Buried Via
- Stacked Vias
- Laser Milling
- RF Trenching
- Minimum Thickness .002
- Maximum Thickness .600 +
- Maximum Layers 60+
- Copper, Conductive and Non-Conductive filled Vias
- Via in Pad
Line and Space
- Minimum line .003
- Minimum space .003
Laminates and Materials
- Tetra/DI and Multi-Functional Tg 170
- Polyimide
- Rogers
- Taconic
- RF Foam
- Mixed Materials
- Hybrid Constructions
- Thermount
- High Speed Nelco and Isola Materials
- Teflon/PTFE
- Minimum Cladding ¼ -oz.
- Maximum Cladding 10 oz.
- Minimum Core Thickness .002
- Maximum Core Thickness .125 to .600+
Drilling
- Minimum Mechanical Drilled Hole .005
- Laser Drilling with Holes as Small as .003”
Solder Mask and Legend Inks
- Per IPC-SM-840
- Dry film
- Liquid Photo imageable
- Direct Imaging
- Laser Direct Imaging
- S/M Colors: Green, Red, Blue, Black, Yellow, Clear and More
- Legend Inks: White, Red, Yellow, Black, Orange
- Color choices as wide as the Rainbow
Surface Finish
- Hot Air Solder Level
- Electroless Nickel / Immersion Gold
- Full Body Nickel / Gold – Hard or Soft Wire Bondable
- Selective Nickel / Gold
- Organic Surface Preservative
- Immersion Tin / Silver
- NI-PD-AU
- ENEPIG
- EPIG
- EPAG
- Electroless AU
Fabrication
- Single & Array Panel
- Beveling
- Countersink & Counterbore
- Edge/Controlled Depth Milling
- Scoring
- Back Drilling
- Trenching
- Cavities
- Multi-level Cavities
Automatic Optical Inspection – AOI
- Inner Layers
- Outer layers
- Via Filled -Plugged
- Laser Drilled Vias
Laboratory Testing
- Thermal Stress Cross Sections
- Ionic Contamination Testing
- TDR Impedance Verification
- Dielectric and Structural Integrity Verification
- Group A / Group B
Product Types
- Single Sided to Multi-layer Construction
- Hybrid Construction
- Pure PTFE build
- Fusion Bond
- Antennas
- Microwave
- Critical RF
- High Speed
- Homogenous Constructions
- Hermetic Materials
- Multi Chip Module
- Surface Mount
- C.O.B
- B.G.A
- Selective Heat-Sink
- Copper Coin
Data Format Files Accepted
- IPC-2581
- OBD ++
- 274D Gerber
- 274X Gerber
- Mentor Neutered Net List
- HPGL
- DXF
- TIFF
- DWG
- NC Drill
- Excellon
- IPCD356 Net List
Data Transfer Methods
- FTP via the website
- FTP via your software
- E-mail: sales@ace-pcb.com (100mb limit)
- Flash drive