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Technology Roadmap

Design/Manufacturing Parameters Standard Technology Advanced Technology Future Technology     
Minimum Internal Line Width 0.005″ 0.003″ >0.002″
Minimum Internal Spacing 0.005″ 0.002″ >0.002″
Minimum External Line 0.005″ 0.003″ >0.002″
Minimum External Spacing 0.005″ 0.002″ >0.002″
Minimum Internal Copper Foil 0.0007″ 0.00035″ 0.000175″
Maximum Internal Copper Foil 0.0042″ 0.0056″(+) 0.0084″(+)
Minimum External Copper (TOTAL) 0.0014″ 0.0007″ 0.00035″
Maximum External Copper (TOTAL) 0.0084″ 0.0112″ 0.0168
Minimum Internal Pad Over Drilled Hole Size 0.012″ 0.006″ 0.004″
Minimum External Pad Over Drilled Hole Size 0.010″ 0.006″ 0.004″
Minimum Drilled Hole Size 0.010″ 0.006″ >0.005″
Minimum Aspect Ratio 12:01 16:01 18:01
Minimum Finished Hole Tolerance 0.003”+/- 0.002”+/- 0.001”+/-
Minimum SMT Pitch 0.015” 0.010” >0.0012”
Maximum Layer Count 22 Lyr 30+ Lyr 50+ Lyr
Minimum Dielectric Thickness 0.002” 0.0012” >0.0012”
Maximum Overall Thickness .250 .400” .750”
Minimum Board Thickness (Multi-Layer) .031” .014” .008”
Buried Resistor Tolerance 30% 15%
Buried Capacitance PF / in 2 500 600
Testing Standard Technology Advanced Technology Future Technology     
Electrical Test – Continuity (ohms) 10 5 2
Electrical Test – Isolation (M ohms) 10 100 100+
Electrical Test – Minimum Component Pitch .015″ .010″ .007″
Impedance Testing (incl. Differential) Range (ohms) 25 – 150 25 – 150 25 – 150
Impedance Tolerance 10% +/- 5% +/- 1 -2 ohms
DC Resistance Testing X X X
Laminates Standard Technology Advanced Technology Future Technology     
FR-4 Epoxy (hi-Tf) X X X
Polyimide X X X
PTFE (Teflon) X X X
Rogers 4350 X X X
Rogers 4003 X X X
Rogers (others) X X X
BT X X X
Cynate Ester X X X
PPO / Polyphenylene Oxide X X X
G-Tec / FR-408 / Nelco 4103-13 X X X
Special Features Standard Technology Advanced Technology Future Technology     
Blind / Buried Vias X X X
Conductive Epoxy Fill X X X
Via in SMT / BGA X X X
Sequential Lamination X X X
Suspended Circuitry X X X
Precision Pad Technology X X X

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