(714) 546-2162     Sales@ace-pcb.com     Facebook

Capabilities

Data Transfer Methods
  • FTP via the website
  • FTP via your software
  • E-mail: sales@ace-pcb.com (100mb limit)
  • Flash drive

 

Panel Sizes
  • 6 x 9 through 26 x 30
  • Maximum image size 24 x 23
Laminates and Materials
  • Die-functional
  • Tera-functional
  • Multifunctional Tg170
  • Polyimide
  • PTFE/Rodgers/Gore
  • Taconic/Arlon
  • Lead free/Halogen free
  • Full range of specialty laminates
  • Minimum cladding 1/4-oz
  • Maximum Internal copper 6oz with UL certification
  • Maximum outer layer cladding 10oz + plating
  • Minimum core thickness .002
  • Maximum core thickness .173
Product Types
  • 1 and 2-sided
  • Multi-layers up to 50+ layers
  • Surface mount
  • Chip on board
  • Ball grid array
  • Multi-chip module
  • Flip chip
Line and Space
  • Minimum line .003
  • Minimum space .003
  • Can go .002 line with .003 space or vice versa.
Electrical Test
  • 1 and 2-sided SMD
  • Dual access net list
  • Flying probe to 10 mil pitch
Solder Mask and Legend Inks
  • Per IPC-SM-840
  • Dry film
  • Liquid photo imagable
  • Custom S/M colors
  • Legend inks: whilte, red, yellow, blue, black and orange
Data Format Files Accepted
  • IPC-2581
  • OBD ++
  • 274D Gerber
  • 274X Gerber
  • Mentor Neutered Net List
  • HPGL
  • DXF
  • PDF
  • TIFF
  • DWG
  • NC Drill
  • Excellon
  • IPCD356 Net List
Construction
  • Balanced
  • Controlled dielectric
  • Controlled impedance +/- 2%
  • Blind and buried via
  • Minimum thickness .002
  • Maximum thickness .600
  • Maximum layer 50+
Surface Finish
  • Hot air solder level
  • Electroless nickel/gold
  • Full body nickel/gold
  • Selective nickel/gold
  • Organic surface preservative
  • Immersion Tin/silver
  • Ni/AU/PD
Drilling
  • Minimum drilled hole .005
  • Minimum pad size over finished hole size: Internal .008, external .008
  • Class 3 laser drilling
Fabrication
  • Single and array panel
  • Beveling
  • Countersink and counter bore
  • Edge milling
  • Scoring
  • Controlled depth drilling and milling
Laboratory Testing
  • Thermal stress cross selections
  • Ionic contamination testing
  • TDR impedance verification
  • Dielectric spacing verification
  • Tg and FTIR
  • Full service outside lab available

© 2017 Accurate Circuit Engineering. All Rights Reserved. Terms and Conditons