Panel Sizes
  • 6 x 9 Through 26 x 30
  • Maximum Circuits Size 24 x 28
Construction
  • Balanced
  • Controlled Dielectric
  • Controlled Impedance +/- 5% (2% Available)
  • Blind & Buried Via
  • Stacked Vias
  • Laser Milling
  • RF Trenching
  • Minimum Thickness .002
  • Maximum Thickness .600 +
  • Maximum Layers 60+
  • Copper, Conductive and Non-Conductive filled Vias
  • Via in Pad
Line and Space
  • Minimum line .003
  • Minimum space .003
Laminates and Materials
  • Tetra/DI and Multi-Functional Tg 170
  • Polyimide
  • Rogers
  • Taconic
  • RF Foam
  • Mixed Materials
  • Hybrid Constructions
  • Thermount
  • High Speed Nelco and Isola Materials
  • Teflon/PTFE
  • Minimum Cladding ¼ -oz.
  • Maximum Cladding 10 oz.
  • Minimum Core Thickness .002
  • Maximum Core Thickness .125 to .600+
Drilling
  • Minimum Mechanical Drilled Hole .005
  • Laser Drilling with Holes as Small as .003”
Solder Mask and Legend Inks
  • Per IPC-SM-840
  • Dry film
  • Liquid Photo imageable
  • Direct Imaging
  • Laser Direct Imaging
  • S/M Colors: Green, Red, Blue, Black, Yellow, Clear and More
  • Legend Inks: White, Red, Yellow, Black, Orange
  • Color choices as wide as the Rainbow
Surface Finish
  • Hot Air Solder Level
  • Electroless Nickel / Immersion Gold
  • Full Body Nickel / Gold – Hard or Soft Wire Bondable
  • Selective Nickel / Gold
  • Organic Surface Preservative
  • Immersion Tin / Silver
  • NI-PD-AU
  • ENEPIG
  • EPIC
  • EPAG
  • Electroless AU
Fabrication
  • Single & Array Panel
  • Beveling
  • Countersink & Counterbore
  • Edge/Controlled Depth Milling
  • Scoring
  • Back Drilling
  • Trenching
  • Cavities
  • Multi-level Cavities
Automatic Optical Inspection – AOI
  • Inner Layers
  • Outer layers
  • Via Filled -Plugged
  • Laser Drilled Vias
Laboratory Testing
  • Thermal Stress Cross Sections
  • Ionic Contamination Testing
  • TDR Impedance Verification
  • Dielectric and Structural Integrity Verification
  • Group A / Group B
Product Types
  • Single Sided to Multi-layer Construction
  • Hybrid Construction
  • Pure PTFE build
  • Fusion Bond
  • Antennas
  • Microwave
  • Critical RF
  • High Speed
  • Homogenous Constructions
  • Hermetic Materials
  • Multi Chip Module
  • Surface Mount
  • C.O.B
  • B.G.A
  • Selective Heat-Sink
  • Copper Coin
Data Format Files Accepted
  • IPC-2581
  • OBD ++
  • 274D Gerber
  • 274X Gerber
  • Mentor Neutered Net List
  • HPGL
  • DXF
  • PDF
  • TIFF
  • DWG
  • NC Drill
  • Excellon
  • IPCD356 Net List
Data Transfer Methods
  • FTP via the website
  • FTP via your software
  • E-mail: sales@ace-pcb.com (100mb limit)
  • Flash drive

 

MIL-PRF-55110 / 31032 AS9100D / ISO 9001 ITAR

Small Business Concern